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| (R) BYT230PIV-400 BYT231PIV-400 FAST RECOVERY RECTIFIER DIODES FEATURES VERY LOW REVERSE RECOVERY TIME VERY LOW SWITCHING LOSSES LOW NOISE TURN-OFF SWITCHING INSULATED PACKAGE : Insulating voltage = 2500 VRMS Capacitance = 45 pF K2 A2 A2 K1 K1 A1 K2 A1 BYT231PIV-400 BYT230PIV-400 DESCRIPTION Dual high voltage rectifiers ranging from 200V to 400V suited for Switch Mode Power Supplies and other power converters. The devices are packaged in ISOTOP. ABSOLUTE MAXIMUM RATINGS Symbol IFRM IF(RMS) IF(AV) IFSM Tstg Tj Parameter Repetitive peak forward current RMS forward current Average forward current Surge non repetitive forward current Storage and junction temperature range Tc=75C = 0.5 tp=10ms sinusoidal ISOTOPTM (Plastic) Value tp 10s Per diode Per diode Per diode Unit A A A A C C 500 50 30 350 - 40 to + 150 - 40 to + 150 Symbol VRRM Parameter Repetitive peak reverse voltage BYT230PIV- / BYT231PIV400 Unit V ISOTOP is a trademark of STMicroelectronics. August 1998 Ed : 3B 1/5 BYT230PIV-400 / BYT231PIV-400 THERMAL RESISTANCE Symbol Rth (j-c) Rth (c) Junction to case Coupling Parameter Per diode Total Value 1.5 0.8 0.1 Unit C/W C/W When the diodes 1 and 2 are used simultaneously : Tj(diode 1) = P(diode) x Rth(Per diode) + P(diode 2) x Rth(c) ELECTRICAL CHARACTERISTICS (Per diode) STATIC CHARACTERISTICS Symbol VF * Test Conditions Tj = 25C Tj = 100C IF = 30 A Min. Typ. Max. 1.5 1.4 Unit V IR ** Tj = 25C Tj = 100C VR = VRRM 35 6 A mA Pulse test : * tp = 380 s, duty cycle < 2 % ** tp = 5 ms, duty cycle < 2 % RECOVERY CHARACTERISTICS Symbol trr Tj = 25C Test Conditions IF = 0.5A IR = 1A IF = 1A VR = 30V Irr = 0.25A dIF/dt = -15A/s Min. Typ. Max. 50 100 Unit ns TURN-OFF SWITCHING CHARACTERISTICS (Without serie inductance) Symbol tIRM dIF/dt = -120A/s dIF/dt = -240A/s IRM dIF/dt = -120A/s dIF/dt = -240A/s TURN-OFF OVERVOLTAGE COEFFICIENT (With serie inductance) Symbol Test Conditions Tj = 100C VCC = 60V IF=IF(AV) Lp = 1H dIF/dt = -30A/s see note see fig.12 Min. Typ. 3.3 Max. Unit / 12 Test Conditions VCC = 200V Lp 0.05H see fig. 11 IF = 30A Tj = 100C Min. Typ. Max. 75 50 9 A Unit ns C= VRP VCC Note : Applicable to BYT230PIV-400/ BYT231PIV-400only To evaluate the conduction losses use the following equation : P = 1.1 x IF(AV) + 0.0095 x IF2(RMS) 2/5 BYT230PIV-400 / BYT231PIV-400 Fig.1 : Low frequency power losses versus average current. P F(av)(W) =0.2 =0.1 =0.05 =0.5 =1 Fig.2 : Peak current versus form factor. 60 55 50 45 40 35 30 25 20 15 10 5 0 0 T IF(av)(A) =tp/T tp 5 10 15 20 25 30 35 Fig.3 : Non repetitive peak surge current versus overload duration. Fig.4 : Relative variation of thermal impedance junction to case versus pulse duration. Fig.5 : Voltage drop versus forward current. Fig.6 : Recovery charge versus diF/dt. 3/5 BYT230PIV-400 / BYT231PIV-400 Fig.7 : Recovery time versus dIF/dt. Fig.8 : Peak reverse current versus dIF/dt. Fig.9 : Peak forward voltage versus dIF/dt. Fig.10 : Dynamic parameters versus junction temperature. Fig.11 : TURN-OFF SWITCHING CHARACTERISTICS (Without serie inductance) Fig.12 : TURN-OFF SWITCHING CHARACTERISTICS (With serie inductance) IF DUT LC VC C VF diF/dt LC LP IF DUT diF/dt VCC VF VCC IRM VCC tIR M VRP 4/5 BYT230PIV-400 / BYT231PIV-400 PACKAGE MECHANICAL DATA ISOTOP Screw version REF. A A1 B C C2 D D1 E E1 E2 G G1 G2 F F1 P P1 S DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. Max. 11.80 12.20 0.465 0.480 8.90 9.10 0.350 0.358 7.8 8.20 0.307 0.323 0.75 0.85 0.030 0.033 1.95 2.05 0.077 0.081 37.80 38.20 1.488 1.504 31.50 31.70 1.240 1.248 25.15 25.50 0.990 1.004 23.85 24.15 0.939 0.951 24.80 0.976 14.90 15.10 0.587 0.594 12.60 12.80 0.496 0.504 3.50 4.30 0.138 0.169 4.10 4.30 0.161 0.169 4.60 5.00 0.181 0.197 4.00 4.30 0.157 0.69 4.00 4.40 0.157 0.173 30.10 30.30 1.185 1.193 Marking : Type number Cooling method : C Weight : 27 g (without screws) Electrical isolation : 2500V(RMS) Capacitance : < 45 pF Inductance: < 5nH - Recommended torque value : 1.3 N.m (MAX 1.5 N.m) for the 6 x M4 screws. (2 x M4 screws recommended for mounting the package on the heatsink and the 4 screws given with the screw version). - The screws supplied with the package are adapted for mounting on a board (or other types of terminals) with a thickness of 0.6 mm min and 2.2 mm max. Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsIbility for the consequences of use of such informationnor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1998 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A. 5/5 |
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